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IWO66X

IW066X is a high-performance Wi-Fi 6 and Bluetooth 5.2 and 802.15.4 module in LGA package launched by Eagle. Under the IEEE 802.11ax standard protocol, it supports MCS 0–MCS 9 rates in a 20 MHz bandwidth with 256QAM supported. The module is designed with a reliable SDIO 3.0 or USB 2.0 interface to provide WLAN capability.

View Spec Sheet

Wi-Fi 6 & Bluetooth 5.2 &
802.15.4 Module

  • IEEE 802.11 a/b/g/n/ac

  • Bluetooth Interface

  • LGA Package

  • Extended Temperature Range: -40°C to +85°C

  • USB2.0 Interface (Optional)

  • Ultra Compact Size

General
WLAN Protocol IEEE 802.11 a/b/g/n/ac/ax
Wi-Fi Frequency Band 2.4 GHz/ 5 GHz
Wi-Fi Antenna 1 × 1
Wi-Fi Modulation Mode DSSS/ OFDM/ DBPSK/ DQPSK/ CCK/ BPSK/ QPSK/ 16QAM/ 64QAM/ 256QAM/ OFDMA
Encryption Mode WPA2/ WPA3
Wi-Fi Operating Mode AP/ STA/ AP+STA
802.15.4 Supported
Bluetooth Protocol Bluetooth 5.2
Temperature Range
Operating Temperature -40 °C to +85 °C
Storage Temperature -45 °C to +95 °C
Max. Data Rates
802.11a 54 Mbps
802.11b 11 Mbps
802.11g 54 Mbps
802.11n 72.2 Mbps
802.11ac 86.7 Mbps
802.11ax 114.7 Mbps
Interfaces
Option 1 SDIO3.0 × 1 (for Wi-Fi) - Uart × 1 (for BLE) - SPI × 1 (for 802.15.4)
Option 2 USB2.0 × 1 (for Wi-Fi & BLE) - SPI × 1 (for 802.15.4)
Certifications
Regulatory (To Be Determined) - Europe CE
Regulatory (To Be Determined) - America FCC
Regulatory (To Be Determined) - Canada IC
Regulatory (To Be Determined) - Australia/New Zealand RCM
Resources
Spec Sheet Eagle IW066X

Key Features

  • 2.4 GHz/ 5 GHz Wi-Fi bands, Bluetooth 5.2 and 802.15.4
  • SDIO 3.0 or USB2.0 interface that supports higher data transmission rate and enables lower power consumption
  • Faster time-to-market: simple design minimizes design-in time and development efforts
  • Wide operating temperature range: -40 °C to +85 °C

Product Description

With an ultra-compact size of 14.0 mm × 13.0 mm × 2.0 mm, IW066X optimizes the size and cost for end-products, which fully meets the demands of size-sensitive applications.

Surface-mount Technology (SMT) makes IW066X an ideal solution for durable and rugged designs. The low profile and small size of LGA package ensure that the module can be easily embedded into size-constrained applications and provide reliable connectivity with these applications. The advanced package, integrated shielding cover and the laser-engraved label with better heat dissipation and indelible markings allow for large-scale automated manufacturing that has strict requirements on cost and efficiency. Coupled with its compact size and wide operating temperature range, IW066X is suitable for a variety of smart home and industrial applications.

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